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Aerospace Research Institute 771
The Xi'an Institute of Microelectronics Technology (also known as Lishan Microelectronics Company, Xi'an Institute 771, and the 771st Research Institute of the Ninth Academy, China Aerospace Science and Technology Corporation) is affiliated with the Ninth Academy of the China Aerospace Science and Technology Corporation. It specializes in the research, development, production, and testing of cutting-edge technologies across three key fields: computers, semiconductor integrated circuits, and hybrid integration. As the nation’s only large-scale, specialized institute integrating research, development, and manufacturing in these three critical areas—computers, semiconductor ICs, and hybrid integration—it also served as the founding institution behind ZTE Corporation, one of the world’s top 100 IT companies. Moreover, the institute has been a pioneering force and a leading contributor to China’s aerospace microelectronics and computing industries.
Established in October 1965, the Xi'an Institute of Microelectronics Technology has earned numerous prestigious awards, including multiple National First-Class Awards for Scientific and Technological Progress and Special Prizes from the National Defense Science and Technology Progress Awards. The institute has also received accolades such as the National May Day Labor Medal, the Outstanding Contribution Award for High-Tech Equipment Development Projects, the Outstanding Contribution Unit for China’s Chang’e-2 Lunar Exploration Mission, as well as titles like "Advanced Collective of Shaanxi Province" and "Model Civilized Unit of Shaanxi Province."
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Aerospace Research Institute No. 772
The Beijing Institute of Microelectronics Technology, established in 1994 and affiliated with the Ninth Academy of China Aerospace Science and Technology Corporation, is a national-level engineering research institute specializing in the development of aerospace-grade and highly reliable ultra-large-scale integrated circuits. The institute’s radiation-resistant components and technologies related to the "BeiDou-2" project have collectively earned numerous prestigious national science and technology awards, including the State Technological Progress Grand Prize and the State First-Class Award for Invention. Additionally, its flip-chip packaging technology has been recognized with both the China Quality Award and China’s first-ever Patent Gold Award in the military component sector. As of 2019, the institute boasts a first-tier master’s program in Electronic Science and Technology, as well as a postdoctoral workstation, having trained over 170 graduate students to date. It has also established collaborative training partnerships with several leading universities. Headquartered in Beijing, the institute maintains branch offices in Xi'an, Shanghai, and Shenzhen, playing a critical role in supplying integrated circuits for key national projects.
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Shanghai Fudan Microelectronics Group Co., Ltd. is a leading domestic company specializing in the design, development, production (including testing), and provision of comprehensive system solutions for ultra-large-scale integrated circuits. Established in July 1998, the company was listed on the Hong Kong stock exchange in 2000 and later transitioned to the Hong Kong Main Board in 2014. It stands as one of the earliest and first publicly listed joint-stock integrated circuit design enterprises in China. In 2021, the company successfully listed on the STAR Market of the Shanghai Stock Exchange, solidifying its "A+H" dual-listing capital structure. Today, Fudan Microelectronics Group has established robust product lines covering security and identification chips, non-volatile memory devices, smart meter chips, FPGA chips, and integrated circuit testing services. Its products are marketed across more than 30 countries and regions, finding extensive applications in diverse sectors such as finance, social security, automotive electronics, urban public transportation, digital identity management, mobile payments, anti-counterfeiting and traceability systems, smartphones, security surveillance, industrial control, signal processing, and intelligent computing.
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China Electronics Technology Group Corporation No. 13 Institute
The China Electronics Technology Group Corporation's 13th Research Institute, founded in Beijing in 1956 and relocated to Shijiazhuang, Hebei Province, in 1963, is a leading, innovation-driven, and comprehensive research institution specializing in core semiconductor electronic components. It boasts significant scale, robust technical capabilities, and a fully integrated professional structure. As a vital supplier of high-end, cutting-edge electronic components and a pioneering hub for innovation in new semiconductor devices and technologies in China, the 13th Institute focuses on five key technological areas: microelectronics, optoelectronics, Micro-Electro-Mechanical Systems (MEMS), advanced semiconductor sensors, and optomechatronic integrated microsystems. Additionally, it emphasizes foundational support areas such as electronic packaging, materials science, and metrology testing.
Since its establishment, the institute has achieved over 60 domestic firsts in the semiconductor field and has accumulated more than 3,100 scientific research breakthroughs. Among these, 63 achievements have earned national-level awards, while 500 have received recognition at the ministerial or provincial level. Furthermore, over 550 research projects have reached internationally leading or advanced standards. In 2020, the institute generated revenues of 8.1 billion yuan and has maintained an A-grade performance rating in the group’s annual assessments for nine consecutive years.
Today, the 13th Institute employs over 7,000 staff members, including 577 professionals holding mid- to senior-level technical titles. Notably, the institute is home to two Group Chief Scientists, three Chief Experts, seven experts who receive special government allowances, and one individual recognized under the National “Hundred, Thousand, Ten Thousand Talents” Program.
The institute operates across two main facilities—the headquarters and the Western Research & Production Zone—covering a total area of 1,500 mu. It comprises four major business divisions, five innovation centers, and 12 controlled subsidiaries. Equipped with nine state-of-the-art R&D and production lines, the 13th Institute has successfully obtained both GJB9001C-2017 and GB-T19001-2016 quality system certifications. It also hosts several prestigious institutions, including a Key National Defense Science and Technology Laboratory, the Innovation Center for Component Packaging Technologies in the Defense Industry, the National Semiconductor Device Quality Supervision and Inspection Center, the Level-2 Metrology Station No. 1312 for the Defense Industry, and the National 863 Program Base for Optoelectronic Device Industrialization, along with a dedicated MEMS Process and Packaging Base.
As a recognized institution for master’s degree programs in engineering and a joint doctoral training partner, the 13th Institute also maintains a thriving postdoctoral research workstation. Moreover, it publishes and distributes two nationally recognized core journals: *Semiconductor Technology* and *Micro-Nano Electronic Technology*.
The 13th Institute has established a fully independent and controllable technology ecosystem spanning from materials and design to advanced manufacturing processes, testing, and packaging. This integrated approach enables it to deliver a comprehensive product supply chain—from individual chips and components to sophisticated integrated microsystems. Its products are widely deployed in critical electronic systems across naval, land, air, and aerospace applications, firmly positioning the institute as a cornerstone in achieving self-reliance and control over core electronic components for China’s defense and military equipment.
Beyond its core defense applications, the 13th Institute is actively expanding into emerging strategic sectors such as microwave and RF communications, electronic ceramic packaging, power electronics for renewable energy, and advanced sensor technologies. The institute has forged strong technical partnerships with globally renowned companies and research institutions, fostering extensive collaboration and knowledge exchange. As a result, its products not only meet the growing demand for domestic substitution but are also exported to over 20 countries and regions worldwide.
Looking ahead, the 13th Institute remains steadfast in its commitment to national security and technological independence. Rooted in Hebei Province, it continues to champion self-reliance and innovation, dedicating itself wholeheartedly to advancing China’s semiconductor industry. By doing so, the institute underscores its unwavering dedication to becoming a trusted "national strategic asset" in the realm of core semiconductor components—a testament to its pivotal role in safeguarding and strengthening China’s technological sovereignty.
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China Electronics Technology Group Corporation No. 58 Institute
The 58th Research Institute of China Electronics Technology Group Corporation is a key research institute in China specializing in the scientific research and production of military-grade integrated circuits. It serves as a vital supplier and service provider of national defense ICs, primarily focusing on the R&D and manufacturing of ultra-large-scale integrated circuits. The institute boasts a complete industry chain spanning from IC design and fabrication to testing, packaging, reliability assessment, and application support.
Over more than 30 years of development, CETC 58 has emerged as a leading comprehensive service platform for military ICs in China, offering end-to-end, multi-input/multi-output solutions tailored to meet the needs of the entire defense industry. Notably, it operates the country’s only domestically developed, fully self-controlled mask-making production line capable of 0.13μm technology. Additionally, the institute maintains a military-standard production line for 5/6-inch CMOS processes ranging from 0.5μm to 3.0μm, as well as an 8-inch standard production line for 0.13μm to 0.18μm CMOS technologies. It has also established advanced process platforms such as radiation-resistant 0.8μm and 0.6μm SOI CMOS technologies, along with HV SOI processes.
CETC 58 was also the first in China to introduce a ceramic packaging production line compliant with military standards, enabling high-density ceramic encapsulation up to 2,200 pins, as well as SiP and 3D packaging solutions. Furthermore, the institute has built one of the most comprehensive testing service platforms in the country, equipped with state-of-the-art facilities for screening, qualification, certification, and failure analysis—facilities that have earned dual accreditation from both national and defense-level testing laboratories.
Complementing its robust infrastructure, CETC 58 offers a 12-inch wafer-level packaging microsystem manufacturing service platform. This platform allows the institute to collaborate closely with customers, addressing their specific requirements at the microsystem, chip, or manufacturing levels. Services include chip functional/logic layout design, mask fabrication, prototype runs, bare-chip KGD testing, electromagnetic and thermal simulations, heterogeneous 3D integration, and comprehensive reliability assessments—all delivered as part of a seamless, end-to-end manufacturing process.
Since its establishment, CETC 58 has pioneered China’s first ultra-large-scale integrated circuit and has undertaken over 500 critical national research projects. The institute has earned 18 national awards and nearly 200 provincial and ministerial-level honors. Each year, it supplies a vast array of essential military components to domestic defense sectors, including aerospace, electronics, weaponry, and naval industries. Many of these products have filled critical domestic gaps, breaking through international embargoes and significantly boosting the localization rate of core semiconductor components. As a result, CETC 58 has made outstanding contributions to every stage of China’s microelectronics development.
Today, the institute’s flagship offerings include a wide range of chips such as SoCs/SiPs, DSPs, FPGAs, MCUs, EEPROMs, DDSs, AD/DA converters, ASICs, and power management devices, alongside integrated products like modules, boards, components, and microsystems. Its product portfolio has further expanded into cutting-edge IoT applications, including secure communications, industrial control systems, smart home solutions, and wearable devices.
Looking ahead, CETC 58 remains steadfastly committed to its core value of "putting national interests above all else." Guided by its enduring mission—to drive advancements in China’s semiconductor technology and ensure the independent, secure supply of integrated circuits for national information systems and weapon platforms—the institute will continue to prioritize talent development, foster technological innovation, and deepen military-civilian collaboration. By relentlessly enhancing its core competencies and advancing its modern enterprise management framework, CETC 58 plans to execute its strategic transformation under the "1-2-3-4-5" initiative. Ultimately, the institute aims to establish itself as a world-class, globally recognized provider of integrated products and services, delivering unmatched excellence within China while setting new global benchmarks in the industry.
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China Electronics Technology Group Corporation No. 40 Institute
The China Electronics Technology Group Corporation's 40th Research Institute (referred to as "Institute 40"), also known as the Bengbu Connector and Relay Research Institute, is China's leading specialized research institute focusing on connectors and relays. Established in 1968 in Feng County, Shaanxi Province, it was relocated to Bengbu, Anhui Province, in 1982.
Authorized and approved by the state, Institute 40 serves as the "Quality Supervision and Inspection Center for Connectors and Relays in the Information Industry," among other specialized institutions. It plays a pivotal role in influential industry bodies such as the Component Branch of the Chinese Society of Electronics, the National Technical Committee for Standardization of High-Frequency Cables and Connectors for Electronic Equipment, and the Relay Branch of the China Electronic Components Industry Association—each recognized as authoritative in their respective fields.
Institute 40 is primarily engaged in the research, development, and mass production of electromechanical components, including connectors, relays, metal housings, automotive electronics, and photovoltaic systems. The institute boasts a highly skilled technical and R&D team, equipped with cutting-edge capabilities in product design, process innovation, and manufacturing. It also holds comprehensive qualifications for advanced equipment research, production, and quality/safety assurance systems. To date, Institute 40 has achieved over 700 scientific and technological breakthroughs, earning more than 80 provincial and ministerial-level science and technology awards, and has spearheaded the development of five international standards.
Its products are widely deployed across multiple critical sectors driving China’s modernization efforts, supporting some of the nation’s most significant engineering projects and making substantial contributions to the growth of China’s information industry.
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Zhuhai Hangyu Micro Technology Co., Ltd. (formerly known as Zhuhai Orbit Micro Technology Co., Ltd.) was established in March 2000 in the Zhuhai Special Economic Zone. It is an IC design company listed on China's Growth Enterprise Board, specializing in the research, development, and production of aerospace electronics, artificial intelligence technologies, micro-nano satellite constellations, satellite big data, and intelligent mapping solutions. The company serves a wide range of industries, including aerospace, industrial control, geographic information, land resources, agriculture, forestry, fisheries, environmental protection, transportation, smart cities, digital government initiatives, modern finance, and consumer applications. Committed to developing cutting-edge embedded control core technology products at the international forefront, the company aims to become a globally recognized supplier of core components and integrated module solutions. As a key enterprise in China’s aerospace sector, it is also one of the leading companies involved in the development of high-reliability embedded SOC chips and system integration—playing a pivotal role in China’s major "Nuclear High Base" national research projects.
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Shenzhen Guowei Electronics Co., Ltd., established in 1993, was the first integrated circuit design company initiated under China's national "909" Project. The company primarily focuses on the R&D, production, testing, and sales services of specialized integrated circuits. Its product portfolio spans seven major series, including microprocessors, programmable devices, memory chips, network buses and interfaces, analog components, SoPC system devices, and custom-designed chips. Following a successful restructuring at the end of 2012, the company was listed on the stock market and is now part of Tsinghua Unigroup’s publicly traded subsidiary, Tsinghua Unigroup Microelectronics. With an experienced R&D team boasting extensive chip-design expertise, Guowei has mastered advanced SoPC design and verification technologies capable of handling designs exceeding 100 million gates. The company has also established cutting-edge platforms for CMOS process design, testing, and validation at nodes below 14nm ultra-deep sub-micron technology. Its products cater to diverse industry needs and have forged strategic partnerships with several leading domestic enterprises across various sectors, earning widespread market recognition and a solid reputation.
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Jinzhou 777 Microelectronics Co., Ltd. traces its origins to the state-owned 777 Semiconductor Specialty Factory, which boasts over 50 years of manufacturing history. As one of the nation’s first designated production facilities for analog integrated circuits, the company currently operates three dedicated production lines: a monolithic analog IC line, a hybrid IC line, and a microcircuit module line.
The monolithic analog IC line primarily produces more than 100 product varieties, including operational amplifiers, voltage comparators, timing circuits, voltage references, and integrated regulators, with an annual production capacity of 600,000 units. Meanwhile, the hybrid IC line has an annual output capacity of 50,000 units, while the microcircuit module line can produce up to 20,000 modules per year.
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Beijing Gala Electronics Co., Ltd. (hereinafter referred to as "Gala Electronics") was originally established in March 2004 as Beijing Gala Electronics System Technology Co., Ltd., and was restructured into a joint-stock company in 2016. Located at No. 5 Lianhuayuan, Haidian District, Beijing, the company is a nationally accredited High-Tech Enterprise, an Integrated Circuit Design Enterprise recognized by the Ministry of Industry and Information Technology, and a "Gazelle" enterprise within the Zhongguancun National Independent Innovation Demonstration Zone. Since 2012, it has continuously earned the title of "Civilized Unit" in Haidian District and the "Trusted Enterprise" designation from the Zhongguancun Science Park. In May 2022, Gala Electronics was awarded the title of "Specialized, Fine, and New" Small and Medium-Sized Enterprise by Beijing Municipality, and in August of the same year, it was officially recognized by the Ministry of Industry and Information Technology as a National "Little Giant" Enterprise specializing in niche markets with exceptional expertise and innovation.
From its inception, Gala Electronics has been dedicated to the integrated circuit industry, steadfastly upholding the core values of "Integrity, Collaboration, and Innovation." The company adheres to a robust quality management philosophy: "Innovative Development, First-Class Quality, Customer First, and Pursuit of Excellence." In 2006, Gala Electronics established a quality management system compliant with the GB/T19001-2000 idt ISO9001:2000 standard. Following a rigorous on-site assessment, the company successfully obtained the necessary certifications, ensuring standardized management practices that have effectively supported the seamless execution of its research and production objectives.
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Shengbang Microelectronics was founded by seasoned semiconductor design engineers with the vision of becoming a leading, full-service analog integrated circuit company. From day one, the company has adhered to a business philosophy centered on customer needs, leveraging innovative, iterative approaches to develop and deliver highly reliable, consistently high-quality analog IC products. As an engineer-driven organization, Shengbang Microelectronics has prioritized fostering a culture that empowers its technical teams to push the boundaries of innovation.
From its inception, the company has targeted diverse industrial applications as its core customer base, starting with operational amplifiers and LDOs before gradually expanding its product portfolio to encompass comprehensive analog signal chains, mixed-signal conditioning solutions, and robust system-level power management offerings.
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Zhaoyi Innovation Technology Group Co., Ltd. (stock code: 603986) is a globally leading fabless chip supplier. Founded in April 2005 and headquartered in Beijing, China, the company has established branches and offices across multiple regions, including Shanghai, Shenzhen, Hefei, Xi'an, Chengdu, Suzhou, Hong Kong, Hsinchu in Taiwan, as well as in key markets such as the U.S., South Korea, Japan, the UK, Germany, and Singapore. With a robust global marketing network, Zhaoyi Innovation delivers high-quality, localized support services tailored to meet the needs of its diverse customer base.
The company’s core product portfolio includes memory solutions (Flash and niche DRAM), 32-bit general-purpose MCUs, intelligent human-machine interaction sensors, power management products, and comprehensive system-level solutions. Renowned for their "high performance and low power consumption," these offerings cater to a wide range of industries, including automotive, industrial control, IoT, networking & communications, computing, and consumer electronics—providing customers with end-to-end solutions that drive innovation and efficiency.
Zhaoyi Innovation maintains rigorous quality management standards and has achieved the highest automotive functional safety certification under ISO 26262:2018, specifically at the ASIL D level. Additionally, the company holds certifications such as ISO 9001, ISO 14001, and ISO 45001, along with Dun & Bradstreet accreditation. Committed to advancing industry integration and expanding its strategic footprint, Zhaoyi Innovation has forged strategic partnerships with several leading global wafer manufacturers and packaging/testing facilities. By strengthening collaboration across the semiconductor value chain and optimizing supply chain management, the company continues to champion technological innovation in the semiconductor industry.
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